DD-TCSP
THERMAL CONDUCTIVE SILICONE PAD
Thermal Conductivity: 1.5-8.0 W/m·K | Temp Range: -40°C to +200°C
Thermal silicone pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties.
Product Image
| Test Items | Values |
|---|---|
| Electronic Component Cooling | CPU, GPU, LED modules, power devices, IGBT modules - Improve heat dissipation and prevent overheating |
| Automotive Electronics | Motor controllers, onboard chargers, Battery Management Systems (BMS) - Enhance system stability and lifespan |
| Industrial Power & Transformers | High-frequency transformers, inverters, power modules - Increase thermal efficiency and reduce thermal resistance |
| Telecommunication Equipment | 5G base station modules, optical modules, RF devices - High thermal conductivity while ensuring electrical insulation |
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