DD-PIF
POLYIMIDE FILM
Thickness: 0.025-0.100mm | Temp Class: C (400°C)
Polyimide film (PI film) is a high-performance organic polymer material, and its preparation process involves the condensation reaction of phthalic anhydride (PMDA) and diaminodiphenyl ether (DDE) in strongly polar solvents, followed by film casting and imidization processes to produce it. This product has excellent mechanical properties, temperature resistance -269°C to +400°C, chemical resistance, and electrical performance.
| Test Items | Values |
|---|---|
| Thickness (mm) | 0.025 | 0.030 | 0.040 | 0.050 | 0.075 | 0.100 |
| Tensile Strength (Mpa) - TD | 135 | 145 | 150 | 165 | 150 | 145 |
| Tensile Strength (Mpa) - MD | 160 | 165 | 170 | 170 | 165 | 160 |
| Elongation at break (%) - TD | 50 | 50 | 50 | 60 | 65 | 70 |
| Elongation at break (%) - MD | 45 | 45 | 50 | 55 | 60 | 65 |
| Dielectric Strength (Kv/mm) | 250 | 245 | 230 | 220 | 180 | 175 |
| Surface Resistivity (Ω) | ≥1.0×10¹⁴ |
| Volume Resistivity (Ω·m) | ≥1.0×10¹⁰ |
| Relative Dielectric Constant | 3.5±0.4 |
| Dielectric Dissipation Factor | ≤4.0×10⁻³ |
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